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英文主页 > Scientific Research > Patents

一种极性带电残基工程化的MspA纳米孔及其制备方法和应用

Release time:2026-05-07 Hits:

Affilication of Author(s):中国地质大学(武汉)
Scope of patent:中国
School Sign:中国地质大学(武汉)
Patent description:一种极性带电残基工程化的MspA纳米孔及其制备方法和应用
Note:受理
Type of Patent:发明专利
State of Patent:Pending patent
Application Number:2025117454743
Number of Inventors:3
Service Invention or Not:no